Cart (Loading....) | Create Account
Close category search window
 

Substrate impact on the thermal performance of tape automated bonding components

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

1 Author(s)
Davis, T.L. ; IBM Corp., Austin, TX, USA

The results of thermally characterizing a 160-I/O (input/output) tape automated bonding (TAB) device are reported. A finite-element technique is used to understand and model the thermal processes of the TAB. A three-dimensional (3-D) computer model is developed and validated against experimental data obtained in a natural convection environment. The 3-D model's results indicate that the thermal processes associated with the TAB are not 2-D in nature. A substantial temperature variation is present across much of the device. Several carriers are modeled with the TAB device to determine their thermal effect on the device's thermal characteristics. Reducing the card's cross-section from a multilayer printed circuit board (PCB) to a board with no internal planes substantially impacts the power dissipation capabilities of the component. The use of a molded rather than an FR4 material in the card has a negligible effect on the thermal characteristics of the attached device due to their similar thermal conductivity

Published in:

Components, Hybrids, and Manufacturing Technology, IEEE Transactions on  (Volume:13 ,  Issue: 4 )

Date of Publication:

Dec 1990

Need Help?


IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.