By Topic

The use environments of electronic assemblies and their impact on surface mount solder attachment reliability

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

1 Author(s)
Engelmaier, W. ; Engelmaier Associates Inc., Mendham, NJ, USA

Nine broad use categories are classified for electronic assemblies which are subjected to varying thermal environments during their operational life, and worst-case, but realistic, temperature extremes as well as maximum possible cyclic temperature variations are identified on an annual basis. For these temperature cycles, the annually occurring number of cycles as well as the dwell durations at the temperature extremes are estimated. Accelerated test conditions are suggested for these use categories. Given the use categories, thermal cyclic conditions, and the suggested accelerated test conditions, the test duration to prove reliability for different service lives and a range of acceptable cumulative failure probabilities are developed. The results are discussed in the context of the overall reliability of electronic assemblies. The results are also discussed in the context of the realities and the limitations of accelerated testing and a combined analytical/experimental reliability approach is suggested

Published in:

Components, Hybrids, and Manufacturing Technology, IEEE Transactions on  (Volume:13 ,  Issue: 4 )