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Parallel Heterogeneous Integration of Chip-Scale Parts by Self-Assembly

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4 Author(s)
Kwang Soon Park ; Dept. of Electr. Eng., Univ. of Washington, Seattle, WA, USA ; Ji Hao Hoo ; Baskaran, R. ; Bohringer, K.F.

This letter reports a novel methodology for the orientation-specific parallel heterogeneous integration of parts of various sizes. Assembly sites are designed to only attract specific parts from an unsorted pool using the combined effect of Faraday waves and magnetic forces, achieving one-to-one part-to-site registration. We demonstrate the assembly of two types of thin parts (2000 × 2000 × 100 and 4000 × 4000 × 100 μm3) onto the same substrate through a one-step process. Statistical analysis of the distributions of magnetic forces delimits the suitable range for the strength of Faraday waves to fix nonoptimal initial placements and orientations.

Published in:

Microelectromechanical Systems, Journal of  (Volume:21 ,  Issue: 6 )