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Decoupling optimization for IC-package and PCB systems considering high performance microprocessor core and signal interface interactions

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1 Author(s)
Mandhana, O.P. ; Sigrity, Inc., Campbell, CA, USA

The purpose of this paper is to present a modeling and simulation based efficient DECAP optimization process for high performance microprocessor systems consisting of IC-package and PCB, considering the interactions due to mutual coupling of power delivery networks (PDNs) for core and signal interface, corresponding to multiple power boundaries. Effectiveness of the on-die capacitances and package mounted DECAPS on IC-package and PCB for optimizing the input impedance of multiple PDNs is described and illustrated with several simulation results.

Published in:

Electronic Components and Technology Conference (ECTC), 2012 IEEE 62nd

Date of Conference:

May 29 2012-June 1 2012

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