Cart (Loading....) | Create Account
Close category search window
 

Dynamic bending test analysis of inkjet-printed conductors on flexible substrates

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

6 Author(s)
Halonen, E. ; Dept. of Electron., Tampere Univ. of Technol., Tampere, Finland ; Halme, A. ; Karinsalo, T. ; Iso-Ketola, P.
more authors

The need to optimize space in electronic devices has made flexible electronics an attractive option for manufacturing electronics. Techniques to fabricate flexible circuits have become more and more common and the processes increasingly more efficient. Printed electronics is a potential technique for manufacturing electronic patterns on flexible substrates. In particular, inkjet printing is an effective way to produce fine, thin, conductive structures without touching the substrate material. This study concentrated on dynamic bending analysis of inkjet-printed silver conductors on a polymer substrate. Because printed electronics is a relatively new manufacturing method, not much research is yet available on mechanical endurance of printed structures. By default, thin layers of inkjet-printed traces may just prove to have good tolerance against bending. However, factors such as adhesion between ink layer and substrate and the effect of the porous structure of sintered nanoparticle ink must be studied. This paper evaluates the capability of the inkjet technique on a flexible substrate and benchmarks the results on conventional flexible copper circuit boards. Measurements were made in real time of the resistance of conductors while bending the sample along two different radii. Results showed that printed conductors were superior in endurance over etched copper circuits.

Published in:

Electronic Components and Technology Conference (ECTC), 2012 IEEE 62nd

Date of Conference:

May 29 2012-June 1 2012

Need Help?


IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.