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Stress evolution in an encapsulated MEMS package due to viscoelasticity of packaging materials

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5 Author(s)
Seungbae Park ; State University of New York at Binghamton P. O. Box 6000, Binghamton, NY 13902 ; Dapeng Liu ; Yeonsung Kim ; Hohyung Lee
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Packaging materials influence greatly on reliability and performance of electronics components. While, materials such as molding compound protect the package from the environment; different mechanical properties of materials will inevitably introduce stress to the package. In this study, materials' viscoelastic effect on packaging stress in a MEMS sensor was studied using finite element analysis after measuring the properties of molding compound and die-attach materials in a series of stress relaxation experiments. The stress distribution, stress-time and stress-temperature relationship, were simulated under different final temperatures and cooling rates. It is found that viscoelasticity has significant effect on the packing stress, especially at higher temperature.

Published in:

2012 IEEE 62nd Electronic Components and Technology Conference

Date of Conference:

May 29 2012-June 1 2012