Cart (Loading....) | Create Account
Close category search window
 

“Dual-purpose” remateable Conductive Ball-in-Pit interconnects for chip powering and passive alignment in Proximity Communication enabled multi-chip packages

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

7 Author(s)
Thacker, H.D. ; Oracle Labs., San Diego, CA, USA ; Shubin, I. ; Ying Luo ; Raj, K.
more authors

We propose a novel chip-to-chip interconnection, called Conductive Ball-in-Pit (CBiP), to simultaneously accomplish micron-scale layer-to-layer alignment and power-distribution that are essential in any Proximity Communication (PxC)-enabled multi-chip package. CBiP interconnects are demonstrated: (1) to be remateable, (2) to achieve a low-resistance contact between chips assembled in a face-to-face configuration, (3) to carry greater than 1.7 A of DC current, and (4) to passively align chips to within 3 μm.

Published in:

Electronic Components and Technology Conference (ECTC), 2012 IEEE 62nd

Date of Conference:

May 29 2012-June 1 2012

Need Help?


IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.