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“Dual-purpose” remateable Conductive Ball-in-Pit interconnects for chip powering and passive alignment in Proximity Communication enabled multi-chip packages

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7 Author(s)
Thacker, H.D. ; Oracle Labs., San Diego, CA, USA ; Shubin, I. ; Ying Luo ; Raj, K.
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We propose a novel chip-to-chip interconnection, called Conductive Ball-in-Pit (CBiP), to simultaneously accomplish micron-scale layer-to-layer alignment and power-distribution that are essential in any Proximity Communication (PxC)-enabled multi-chip package. CBiP interconnects are demonstrated: (1) to be remateable, (2) to achieve a low-resistance contact between chips assembled in a face-to-face configuration, (3) to carry greater than 1.7 A of DC current, and (4) to passively align chips to within 3 μm.

Published in:

Electronic Components and Technology Conference (ECTC), 2012 IEEE 62nd

Date of Conference:

May 29 2012-June 1 2012