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Development of anhydride-based NCFs for Cu/Sn-Ag eutectic bonding and process optimization for fine pitch TSV chip stacking

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7 Author(s)
Ji-Won Shin ; Dept. of Mater. Sci. & Eng., Korea Adv. Inst. of Sci. & Technol. (KAIST), Daejeon, South Korea ; Yong-Won Choi ; Young Soon Kim ; Un Byung Kang
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Methyl tetrahydrophthalic anhydride (MeTHPA), and Methyl hexahydrophthalic anhydride (MeHHPA) were added as curing agent for bisphenol A/phenoxy resin-based non-conductive film (NCF). Only NCF with MeTHPA showed thermal stability and void-less interface at 250°C, and addition of 0.5 wt% of latent curing accelerator showed minimum NCF cure at pre-bonding stage (120°C) and full NCF cure after main-bonding stage (250°C). The formulated NCF were applied to TSV chip on substrate bonding with Cu/Sn-Ag double bump to Cu pad joint structure. Film thickness and bonding pressure were optimized at 15 μm and 2.4 MPa to form state-of-art joint structure with optimal fillet shape. The joint structures were observed to be stable even after three reliability tests: high temperature storage test (HTST) of 200 hours, pressure cooker test (PCT) of 24 hours, and thermal cycle (T/C) of 200 cycles. Anhydride-based NCF showed stable joints due to flux-ability of anhydride; however, conventional dicyan diamide (DICY) based NCF showed broken joints after T/C due to lack of flux-ability.

Published in:

Electronic Components and Technology Conference (ECTC), 2012 IEEE 62nd

Date of Conference:

May 29 2012-June 1 2012

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