Cart (Loading....) | Create Account
Close category search window

Simultaneous 6-Gb/s Data and 10-mW Power Transmission Using Nested Clover Coils for Noncontact Memory Card

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

7 Author(s)
Radecki, A. ; Dept. of Electron. & Electr. Eng., Keio Univ., Yokohama, Japan ; Yuxiang Yuan ; Miura, N. ; Aikawa, I.
more authors

An inductive power and data transmission link for a noncontact memory card interface is reported. Nested clover coils improve signal-to-interference ratio and enable simultaneous power and data transmission. This capability is then used in the design of a closed-loop feedback system for improving power transfer efficiency. Interference cancellation mechanism is analyzed with both 3-D EM simulations and a newly developed compact model of coupled inductors. Performance of the proposed solutions was confirmed experimentally using a scaled-down stacked-chip prototype fabricated in a 65-nm CMOS process. Maximum data transmission rate is 6 Gb/s and the total power transfer efficiency is 5.2%-10.2% over a load resistance range of 0.1-2 kΩ.

Published in:

Solid-State Circuits, IEEE Journal of  (Volume:47 ,  Issue: 10 )

Date of Publication:

Oct. 2012

Need Help?

IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.