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Signal integrity: Efficient, physics-based via modeling: Integration of striplines

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8 Author(s)
Rimolo-Donadio, R. ; T.J. Watson Res. Center, IBM, Yorktown Heights, NY, USA ; Selli, G. ; De Paulis, F. ; Xiaoxiong Gu
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In the first article of this series, principles and methods of physics-based via modeling were discussed. It was shown how the electromagnetic behavior of vias can be captured by an equivalent circuit based modeling approach that describes all relevant full-wave effects. In this follow-up article, the authors present an approach to integrate striplines into the physics-based via model. The striplines can be located at any layer of the stackup and they may constitute both single and multiconductor transmission lines. The integration of striplines extends the via representation to a full, efficient interconnect model of, for instance, printed circuit board signal links. An intuitive integration approach at a circuit simulator level and application examples are discussed in this article as well.

Published in:

Electromagnetic Compatibility Magazine, IEEE  (Volume:1 ,  Issue: 2 )

Date of Publication:

Second Quarter 2012

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