Referenced Items are not available for this document.
The factors affecting the temperature dependence of soft error rates (SER) in flip-flops are investigated. Four different flip-flop designs with varying hardness levels were designed and fabricated in a 40 nm bulk CMOS technology. Neutron experiments show an increase in soft error (SE) failure in time (FIT) rate of over 3X for a temperature range of 25 °C - 110 °C. Alpha experiments show 1.5X increase in SE FIT rate for the same temperature range.
Published in:
Reliability Physics Symposium (IRPS), 2012 IEEE International
Date of Conference: 15-19 April 2012
- Page(s):
- SE.2.1 - SE.2.6
- ISSN :
- 1541-7026
- E-ISBN :
- 978-1-4577-1679-9
- Print ISBN:
- 978-1-4577-1678-2
- INSPEC Accession Number:
- 12880264
- Conference Location :
- Anaheim, CA
- Digital Object Identifier :
- 10.1109/IRPS.2012.6241927
- Product Type:
- Conference Publications
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