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Temperature dependence of soft error rate in flip-flop designs

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8 Author(s)
Jagannathan, S. ; Dept. of EECS, Vanderbilt Univ., Nashville, TN, USA ; Diggins, Z. ; Mahatme, N. ; Loveless, T.D.
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The factors affecting the temperature dependence of soft error rates (SER) in flip-flops are investigated. Four different flip-flop designs with varying hardness levels were designed and fabricated in a 40 nm bulk CMOS technology. Neutron experiments show an increase in soft error (SE) failure in time (FIT) rate of over 3X for a temperature range of 25 °C - 110 °C. Alpha experiments show 1.5X increase in SE FIT rate for the same temperature range.

Published in:

Reliability Physics Symposium (IRPS), 2012 IEEE International

Date of Conference:

15-19 April 2012

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