By Topic

Cost-efficient buffer sizing in shared-memory 3D-MPSoCs using wide I/O interfaces

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
Foroutan, S. ; TIMA Lab., Grenoble, France ; Sheibanyrad, A. ; Petrot, F.

This paper addresses link-buffer capacity allocation in the design process of best-effort 3DNoCs holding hotspot memory ports. We show that in 3DSoCs with integrated wide I/O DRAMs, the congestion spreading is different from SoCs with external DRAMs: the bottlenecks are not anymore the external memory ports but the network links that become saturated and retro-propagate the congestion. The distribution of bottleneck links is directly affected by the traffic directed to the hot memory ports. Using an analytical performance evaluation method, we determine network link buffer capacities according to the given workload composed of regular and hotspot traffics.

Published in:

Design Automation Conference (DAC), 2012 49th ACM/EDAC/IEEE

Date of Conference:

3-7 June 2012