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Fuzzy process control of integrated circuit wire bonding

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2 Author(s)
C. Kinnaird ; Dept. of Electr. Eng., Southern Methodist Univ., Dallas, TX, USA ; A. Khotanzad

The paper describes a fuzzy logic controller which sets parameters for the wire bonding process, specifically controlling bonded ball size and shear strength density. The design of the fuzzy engine and the development of rules based on operator experience are discussed. The controller has been tested on actual devices; results show improved process control

Published in:

Fuzzy Information Processing Society, 1997. NAFIPS '97., 1997 Annual Meeting of the North American

Date of Conference:

21-24 Sep 1997