By Topic

Analysis and Design of On-Chip Decoupling Capacitors

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
Charania, T. ; Department of Electrical and Computer Engineering, University of Waterloo, Waterloo, Canada ; Opal, A. ; Sachdev, M.

Power supply noise management continues to be a challenge with the scaling of CMOS technologies. Use of on-chip decoupling capacitors (decaps) is the most common noise suppression technique and has significant associated area and leakage costs. There are numerous methods of implementing decaps and it is not always clear which implementation is the most optimal for the given design constraints. This paper characterizes various decap implementations including MOS-based decaps, multilayer metal decaps, and metal-insulator-metal decaps using postlayout simulations in a 65-nm CMOS technology, and provides an outline for determining the most optimal selection and design of decaps based on area, leakage, and location. Hybrid structures are further shown to boost the area efficiency of conventional nMOS decaps by an additional ${sim}{25%}$.

Published in:

Very Large Scale Integration (VLSI) Systems, IEEE Transactions on  (Volume:21 ,  Issue: 4 )