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Low temperature wafer bonding for MEMS processes and 3D integration

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1 Author(s)
Knechtel, R. ; Process Dev. MEMS, X-FAB Semicond. Foundries AG, Erfurt, Germany

In this paper different wafer bonding processes for completely processed MEMS and CMOS wafers will be introduced and discussed. Low temperature direct bonding, anodic bonding, glass frit bonding and metal compressive bonding can fulfill the requirements for a bonding technique operating at low temperatures and with high quality.

Published in:

Low Temperature Bonding for 3D Integration (LTB-3D), 2012 3rd IEEE International Workshop on

Date of Conference:

22-23 May 2012