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Wafer-level heterogeneous 3D integration for MEMS and NEMS

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10 Author(s)
Niklaus, Frank ; Microsyst. Technol. Lab. (MST), KTH R. Inst. of Technol., Stockholm, Sweden ; Lapisa, M. ; Bleiker, S.J. ; Dubois, V.
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In this paper the state-of-the-art in wafer-level heterogeneous 3D integration technologies for micro-electromechanical systems (MEMS) and nano-electromechanical systems (NEMS) is reviewed. Various examples of commercial and experimental heterogeneous 3D integration processes for MEMS and NEMS devices are presented and discussed.

Published in:

Low Temperature Bonding for 3D Integration (LTB-3D), 2012 3rd IEEE International Workshop on

Date of Conference:

22-23 May 2012