Referenced Items are not available for this document.
300mm Si wafer-scale oxide fusion bonding and mechanical/wet etch assisted wafer thinning processes were combined with a TSV-last 3D integration strategy to fabricate electrical open/short yield learning on through-wafer electrical TSV test chains.
Published in:
Low Temperature Bonding for 3D Integration (LTB-3D), 2012 3rd IEEE International Workshop on
Date of Conference: 22-23 May 2012
- Page(s):
- 203 - 208
- Print ISBN:
- 978-1-4673-0743-7
- INSPEC Accession Number:
- 12863941
- Conference Location :
- Tokyo
- Digital Object Identifier :
- 10.1109/LTB-3D.2012.6238091
- Product Type:
- Conference Publications
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