By Topic

A versatile optical system for metrology and defects inspection of 3D integration processes

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

7 Author(s)
Perrot, S. ; Inst. d''Electron. Fondamentale, Univ. Paris Sud, Orsay, France ; Randle, Y. ; Fresquet, G. ; Le Bellego, D.
more authors

3D Integration of miniaturized systems at wafer level generates new needs of metrology and defects inspection for the control of temporary or permanent wafer bonding, of wafer thinning, of via interconnects technology and of wafer/die stacks. In this paper we demonstrate the capabilities of a versatile optical measurement system combining several microscopy and interferometry techniques in the visible and near infrared wavelength range.

Published in:

Low Temperature Bonding for 3D Integration (LTB-3D), 2012 3rd IEEE International Workshop on

Date of Conference:

22-23 May 2012