A versatile optical system for metrology and defects inspection of 3D integration processes

3D Integration of miniaturized systems at wafer level generates new needs of metrology and defects inspection for the control of temporary or permanent wafer bonding, of wafer thinning, of via interconnects technology and of wafer/die stacks. In this paper we demonstrate the capabilities of a versatile optical measurement system combining several microscopy and interferometry techniques in the visible and near infrared wavelength range.