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3D integration applications for low temperature direct bond technology

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1 Author(s)
Paul Enquist ; Ziptronix, Inc., Morrisville, NC 27560, USA

The attributes of low temperature direct bond technology that have and continue to drive its adoption as an industry standard solution for 3D manufacturing are reviewed. These applications include backside illuminated (BSI) image sensors, 3D BSI, 3D memory, RF front ends, and pico-projectors.

Published in:

Low Temperature Bonding for 3D Integration (LTB-3D), 2012 3rd IEEE International Workshop on

Date of Conference:

22-23 May 2012