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Overview of wafer direct bonding technology: From substrate engineering to heterogeneous integration enabled by 3D wafer stacking

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1 Author(s)
Radu, I. ; Parc Technol. des Fontaines, SOITEC, Bernin, France

The recent advances of the wafer direct bonding technology will be presented in this talk. The overview covers the technology perspective with respect to the fabrication of engineered substrates as well as 3D wafer stacking in light of the different applications for semiconductor industry.

Published in:

Low Temperature Bonding for 3D Integration (LTB-3D), 2012 3rd IEEE International Workshop on

Date of Conference:

22-23 May 2012

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