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Electrodeposition of copper into high aspect ratio PCB micro-via using megasonic agitation

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10 Author(s)
S. Costello ; MIcroSystems Engineering Centre (MISEC), School of Engineering and Physical Sciences, Heriot-Watt University, Edinburgh, EH14 4AS, Scotland, UK. ; N. Strusevich ; D. Flynn ; R. W. Kay
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This paper presents the use of micro-particle imaging velocimetry (micro-PIV) to analyse fluid flow and hence ion replenishment in PCB micro-via during the electroplating process. Megasonic streaming is used to remove bubbles from blind micro-via and promote ion transportation within high aspect ratio PCB micro-via to enhance electrodeposition.

Published in:

Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP), 2012 Symposium on

Date of Conference:

25-27 April 2012