Referenced Items are not available for this document.
This paper presents the use of micro-particle imaging velocimetry (micro-PIV) to analyse fluid flow and hence ion replenishment in PCB micro-via during the electroplating process. Megasonic streaming is used to remove bubbles from blind micro-via and promote ion transportation within high aspect ratio PCB micro-via to enhance electrodeposition.
Published in:
Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP), 2012 Symposium on
Date of Conference: 25-27 April 2012
- Page(s):
- 98 - 102
- Print ISBN:
- 978-1-4673-0785-7
- INSPEC Accession Number:
- 12864768
- Conference Location :
- Cannes
- Product Type:
- Conference Publications
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