By Topic

Optimized and microfabricated ionic wind pump array as a next generation solution for electronics cooling systems

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
Andojo Ongkodjojo Ong ; Department of Electrical Engineering and Computer Science, Case Western Reserve University, 2123 Martin Luther King Jr. Drive, Cleveland, Ohio, USA, 44106 ; Alexis R. Abramson ; Norman C. Tien

This work presents a microfabricated ionic wind pump array that has the potential to meet industry requirements as a next generation solution for thermal management of electronic systems. The optimized single device provides an improved COP of 26.5. The main purpose of the work presented here is to demonstrate that the optimized microfabricated ionic wind pump employed in an array provides superior cooling performance as compared to conventional CPU fans.

Published in:

Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2012 13th IEEE Intersociety Conference on

Date of Conference:

May 30 2012-June 1 2012