By Topic

Three-dimensional visualization of multilayered assemblies using X-ray laminography

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

The purchase and pricing options are temporarily unavailable. Please try again later.
2 Author(s)
Kalukin, A.R. ; Center for Integrated Electron. & Electron. Manuf., Rensselaer Polytech. Inst., Troy, NY, USA ; Sankaran, V.

The imaging technique of X-ray laminography is useful for studying defects in ball grid array, gull-wing and J-lead solder joints. In this process, X-ray images are made to depict cross-sectional planes in multilayered assemblies. It is desirable to be able to create a three-dimensional (3-D) visualization of the assembly by stacking a succession of laminographic cross sections of neighboring planes. In the past this has not been possible for highly layered assemblies because the images contain inherent blurring, which causes the signal-to noise ratio for a 3-D reconstruction to be extremely poor. This paper explains a technique for reconstructing accurate 3-D visualizations of assemblies based upon a small number of laminographic images. Experimental results are described that show that this technique is sensitive to small defects in metallic objects such as ball grid array (BGA) joints

Published in:

Components, Packaging, and Manufacturing Technology, Part A, IEEE Transactions on  (Volume:20 ,  Issue: 3 )