Scheduled System Maintenance:
On Monday, April 27th, IEEE Xplore will undergo scheduled maintenance from 1:00 PM - 3:00 PM ET (17:00 - 19:00 UTC). No interruption in service is anticipated.
By Topic

Finite element analysis of PWB warpage due to the solder masking process

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
Ume, I.C. ; Sch. of Mech. Eng., Georgia Inst. of Technol., Atlanta, GA, USA ; Martin, T. ; Gatro, J.T.

Researchers have begun to examine the various manufacturing processes that a printed wiring board (PWB) undergoes during its production, such as lamination, solder masking, and soldering process to determine their impact on board warpage. The goal of this paper is to determine effects of the solder masking process on the PWB warpage. Finite element analysis was used to study the effects of the solder masking process, in particular the curtain coating and curing processes on PWB warpage of four different board designs. These analyses have aided development of general guidelines that should be observed when selecting solder masking material

Published in:

Components, Packaging, and Manufacturing Technology, Part A, IEEE Transactions on  (Volume:20 ,  Issue: 3 )