Cart (Loading....) | Create Account
Close category search window
 

Fatigue-strength prediction of microelectronics solder joints under thermal cyclic loading

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

2 Author(s)
Qiang Yu ; Dept. of Mech. Eng. & Mater. Sci., Yokohama Nat. Univ., Japan ; Shiratori, M.

The stress-strain analyses for the solder joints in a thin single outline package (TSOP), a ball grid array (BGA) assembly, and a leadless ceramic chip carrier (LCCC) are carried out to investigate the plastic-creep behavior, and stress relaxation behavior due to the temperature cycling or isothermal cyclic loading. The temperature dependence of plastic behavior (yield stress) and creep behavior (creep properties) are taken into consideration in all numerical analyses. The results of finite element analysis (FEA) show that in an accelerated temperature cycling test, long high-temperature and low-temperature dwell times do not contribute to the increase of the cyclic inelastic equivalent strain range in solder joints (although the creep behavior occurring during the dwell times in an operating condition is important enough to be taken into consideration for estimating the fatigue life of solder joints). Based upon the results of the strain analyses, some efficient testing processes of temperature cycling and isothermal fatigue tests for the microelectronic solder joints are proposed, and the cycling tests are carried out. The experimental results show a good agreement with the analytic results

Published in:

Components, Packaging, and Manufacturing Technology, Part A, IEEE Transactions on  (Volume:20 ,  Issue: 3 )

Date of Publication:

Sep 1997

Need Help?


IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.