By Topic

Automatic classification of wafer defects: status and industry needs

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

1 Author(s)
Shapiro, A. ; Adv. Micro Devices Inc., Austin, TX, USA

This paper describes the automatic defect classification (ADC) beta site evaluations performed as part of the SEMATECH ADC project. Two optical review microscopes equipped with ADC software were independently evaluated in manufacturing environments. Both microscopes were operated in bright-field mode with white light illumination, ADC performance was measured on three process levels of random logic devices: source/drain, polysilicon gate, and metal. ADC performance metrics included classification accuracy, repeatability, and speed. In particular, ADC software was tested using a protocol that included knowledge base tests, gauge studies, and small passive data collections

Published in:

Components, Packaging, and Manufacturing Technology, Part C, IEEE Transactions on  (Volume:20 ,  Issue: 2 )