Cart (Loading....) | Create Account
Close category search window

An improved approach to the mutual coupling calculation of conformal array

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
Shunlian Chai ; Inst. of Electron. Eng., Nat. Univ. of Defense Technol., Chungsha, China ; Demiao yao ; Junjie Mao

This paper presents the general expressions of the mutual coupling from waveguide antenna elements on conformal surfaces. Based on direct integration method (DIM) and surface radiation pattern method (SRP), a novel improved surface radiation pattern (ISRP) method is suggested to the calculation of the mutual coupling. The results for the cylinder indicate that ISRP is more accurate than SRP and more efficient than DIM. ISRP is also good at dealing with the mutual coupling of elements with arbitrary polarization, which is helpful to the analysis of conformal arrays on the rotational parabolic which we will do next

Published in:

Aerospace and Electronics Conference, 1997. NAECON 1997., Proceedings of the IEEE 1997 National  (Volume:2 )

Date of Conference:

14-18 Jul 1997

Need Help?

IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.