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This paper reports on the realization of a novel method for batch transfer of multiple separate dies from a smaller substrate onto a larger wafer substrate by using a standard matrix expander in combination with an elastic dicing tape and adhesive wafer bonding. We demonstrate the expansion and transfer of about 30 000 dies from a 100-mm wafer format to a 200-mm wafer. Furthermore, multiple expansions of 100-mm wafers diced into 60 000 dies are evaluated to determine the position accuracy between different expansions. Fabrication, evaluation method, and results are presented.