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The paper investigates the Signal Integrity performance of innovative on-chip interconnects made by carbon-based materials, such as Carbon Nanotubes (CNTs) and Graphene NanoRibbons (GNRs). The innovative solutions are compared to the conventional copper realization. A simple but physically meaningful equivalent circuital model is presented for these interconnects, which properly accounts for the quantistic and kinetic phenomena observed at nanoscale. The models also include effects of interconnect size and temperature. Using this model, a Signal Integrity analysis of the electrical performance of global level on-chip interconnects is carried out, referring to the 22nm technology node.