Cart (Loading....) | Create Account
Close category search window
 

Off-chip detection of radiation from a linear array oscillator with a spiral antenna

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

5 Author(s)
Kiryu, S. ; Dept. of Phys., State Univ. of New York, Stony Brook, NY, USA ; Wenxing Zhang ; Siyuan Han ; Deus, S.
more authors

Radiation from a linear array oscillator with a spiral antenna has been measured using an off-chip coupled bolometer. The array oscillator has a distributed array structure with 300 resistively shunted junctions which are placed in the groups of 6 junctions. The array oscillator was fabricated on a Si wafer with a two-arm spiral antenna. The chip was attached to a Si lens with an anti-reflection coating. Rather large power (>100 nW) was detected at a number of array bias voltages V/sub bias/ from 115 mV to 196 mV, which correspond from 185 GHz to 315 GHz. The maximum measured power was 550 nW at V/sub bias/=125 mV (200 GHz).

Published in:

Applied Superconductivity, IEEE Transactions on  (Volume:7 ,  Issue: 2 )

Date of Publication:

June 1997

Need Help?


IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.