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3D integration: Opportunities, design challenges and approaches

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1 Author(s)
Knochel, U. ; EAS, Fraunhofer IIS, Dresden, Germany

Summary form only given. More than Moore technologies like 3D-integration enable the dense integration of different circuits. With the right partitioning of functional units in a die stack; the system performance can be increased and the power consumption reduced. Design of 3D-integrated systems requests the consideration of several electrical and multi-physical interactions in a stack, e.g. thermal management, power distribution and electromagnetic compatibility stronger than in 2D-SoC-design. Therefore new design flows and tools are under development. The tutorial outlines the current status of technologies and applications for 3D-integration and gives an overview on the design challenges. Approaches for 3D design-flow and algorithms will be presented.

Published in:

Design and Diagnostics of Electronic Circuits & Systems (DDECS), 2012 IEEE 15th International Symposium on

Date of Conference:

18-20 April 2012