Cart (Loading....) | Create Account
Close category search window
 

Eddy-current nondestructive material evaluation by high-temperature SQUID gradiometer using rotating magnetic fields

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
Haller, A. ; Inst. fur Schicht- und Ionentech., Forschungszentrum Julich GmbH, Germany ; Tavrin, Y. ; Krause, H.-J.

To exploit the sensitivity offered by HTS SQUID systems for detection of deep faults inside conductive samples, a new approach was taken to avoid additional noise sources typical of scanning measurements. The excitation fields are rotated by electronic control which permits one to keep the sample and the system stationary during measurements. Flaws of 10 mm and 40 mm length were detected under 12 mm thick covers of aluminum. The orientation of the flaws was mapped by taking advantage of the anisotropic excitation of eddy currents by the chosen differential coils. This approach is particularly promising for ferromagnetically contaminated samples and radially oriented defects, e.g. originating from rivets.

Published in:

Applied Superconductivity, IEEE Transactions on  (Volume:7 ,  Issue: 2 )

Date of Publication:

June 1997

Need Help?


IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.