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Research on TSV positioning in 3D IC placement

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3 Author(s)
Ligang Hou ; VLSI & Syst. Lab., Beijing Univ. of Technol., Beijing, China ; Shu Bai ; Jinhui Wang

This paper forwards two TSV positioning algorithm named middle-cut positioning (MCP) and optimized area positioning (OAP). In 3D IC placement, TSV occupies cell area and its position does affect the real wire length which is ignored in previous works. Its effect should be considered by TSV based wirelength calculation and TSV positioning. Experiments are carried out on 2D-3D transformation of IBM benchmark circuits. Results shows that OAP outrun MCP, which optimized total wirelength in 15 out of 17 benchmark circuits, in which best optimized 11.81%.

Published in:

Electrical Design of Advanced Packaging and Systems Symposium (EDAPS), 2011 IEEE

Date of Conference:

12-14 Dec. 2011