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Impedance of power distribution networks in TSV-based 3D-ICs

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6 Author(s)
Kiyeong Kim ; Department of Electrical Engineering, KAIST, Daejeon, South Korea ; Jun So Pak ; Heegon Kim ; Junho Lee
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To estimate the simultaneous switching noise (SSN) on the three dimensional VDDQ power distribution network (3D VDDQ PDN) in a TSV-based GPU system, the PDN impedance (ZPDN) and the pull up impedance (Zpull-up) of the VDDQ PDN in the GPU system were first estimated and analyzed. The GPU system consisted of a GPU, quadruple-stacked DRAMs, a silicon interposer and an organic package. The impedance estimation method, based on a segmentation method and a balanced-transmission line method (Balanced-TLM), was used for the estimation of the PDN impedance and the pull-up impedance of the 3D VDDQ PDN, combining the models of the chip PDNs, S/G lines, P/G TSV pairs, and a package PDN. The PDN impedance and the pull up impedance were also analysed with respect to the variation in the number of the P/G TSV.

Published in:

Electrical Design of Advanced Packaging and Systems Symposium (EDAPS), 2011 IEEE

Date of Conference:

12-14 Dec. 2011