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A 60-GHz band WPAN transmitter module integrated with a planar dipole antenna using organic substrates and 3-D SiP technology

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6 Author(s)
Satoshi Yoshida ; Research Institute of Electrical Communication, Tohoku University 2-1-1 Katahira, Aoba-ku, Sendai 980-8577, Japan ; Shoichi Tanifuji ; Suguru Kameda ; Noriharu Suematsu
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This paper gives a review of an ultra-small and low-cost 60-GHz band front-end module integrated with a single element planar dipole antenna. For miniaturization and cost reduction, we apply 3-D system-in-package (SiP) technology and organic substrates. The planar dipole antenna is patterned on the top layer substrate in the module. Maximum actual gain of 6.0 dBi at 63 GHz is measured even though single element simple structure antenna is used. Additionally, a structure of a high-gain 60-GHz band planar dipole antenna which is applicable to 60-GHz band 3-D SiP front-end modules is described. To achieve high gain, we extend a dielectric substrate to main-beam direction. Although lossy substrate is used for cost reduction, the antenna patterned on organic substrates has enough potential for being used as a low-cost and simple configuration antenna integrated with the module.

Published in:

Electrical Design of Advanced Packaging and Systems Symposium (EDAPS), 2011 IEEE

Date of Conference:

12-14 Dec. 2011