Close category search window
 

Flexible and Transparent Memory: Non-Volatile Memory Based on Graphene Channel Transistor for Flexible and Transparent Electronics Applications

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

7 Author(s)
Sung Min Kim ; Dept. of Electr. Eng., Univ. of California, Los Angeles, CA, USA ; Song, E.B. ; Lee, Sejoon ; Jinfeng Zhou
more authors

A Flexible and Transparent charge trap Memory (FTM) based on a single-layer graphene (SLG) channel with a ITO gate electrode was fabricated on a flexible and transparent poly-ethylene naphtalate (PEN) substrate. Triple high-k dielectric stacks Al2O3-AlOx-Al2O3 (AAA) were used as a data storage layer. The FTM shows memory characteristics with a memory window larger than 7V while maintaining ~80% of its transparency in the visible wavelength. The adoption of an AAA gate stack effectively suppressed the electron back injection from the gate electrode. This can be utilized for transparent and flexible electronics that require integration of logic, memory and display on a single flexible substrate with high transparency.

Published in:
Memory Workshop (IMW), 2012 4th IEEE International

Date of Conference: 20-23 May 2012

Need Help?


IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2013 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.