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Photo cell monitoring inspection methodology employing a complementary strategy of advanced darkfield and high sensitivity brightfield inspection tools

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10 Author(s)
Jyn Hao Syu ; Defect Manage. Div., United Microelectron. Corp., Tainan, Taiwan ; Chen Chiz Lin ; Chiang, P.Y. ; Chen, N.
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Lithography process monitoring has always been a challenging step in foundry fabs. Broadband brightfield inspectors are used to meet the sensitivity requirement on low contrast photo-cell monitoring (PCM) process layers. However, the throughput of brightfield inspectors often requires reducing sampling rates and/or reducing wafer inspection coverage. In this paper, we introduce an innovative and highly efficient inspection methodology for 2x/4xnm PCM applications. This new defect inspection scheme utilizes a complementary inspection tool set comprised of an advanced darkfield inspection tool and a high sensitivity brightfield inspection tool. This combination provides effective process monitoring of PCM layers and significantly reduces Cost of Operation (CoO).

Published in:

Advanced Semiconductor Manufacturing Conference (ASMC), 2012 23rd Annual SEMI

Date of Conference:

15-17 May 2012