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A novel approach to optical wafer pre-alignment using innovative ranging edge detectors

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3 Author(s)
Jerman, T. ; R&D of Opt. Syst., BRS (Bright Red Syst.), Graz, Austria ; Priewald, R.H. ; Leitgeb, W.

This work describes a novel approach to improving accuracy of optical wafer pre-align systems especially for thin, warped, bonded or carrierless-ultrathin wafers. Using 3D wafer modeling, provided by innovative Ranging Edge Detectors (RED, RE-Detector), the proposed signal processing enables maximum likelihood parameter estimation for best wafer alignment results. Additionally the sensor principle of an RE-Detector enables accurate detection of transparent substrates like sapphire (Al2O3), silicon carbide (SiC) or evec glass wafers. This paper describes how wafer pre-alignment has been modified for thin wafer handling with RED pee-alignment resulting in significantly better position accuracy, less wafer damage and cost reduction.

Published in:

Advanced Semiconductor Manufacturing Conference (ASMC), 2012 23rd Annual SEMI

Date of Conference:

15-17 May 2012

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