By Topic

Potentials of condition based monitoring in semiconductor manufacturing

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
Michael E. Cholette ; University of Texas at Austin, Department of Mechanical Engineering, Austin, TX; USA ; Dragan Djurdjanovic ; John D. Rasberry

Today, the majority of semiconductor fabrication plants (Fabs) conduct equipment preventive maintenance based on statistically derived time-based or wafer count based intervals. While these practices have had relative success in managing equipment availability and managing product yield, the costs, both in time and materials remains high. Condition Based Monitoring (CBM) has been successfully adopted in several industries, where costs associated with equipment downtime range from loss of life to unacceptable affects to companies' bottom line. In this paper, we will investigate a method of CBM to semiconductor manufacturing that addresses some of the issues of CBM in complex systems with multiple operating regimes.

Published in:

2012 SEMI Advanced Semiconductor Manufacturing Conference

Date of Conference:

15-17 May 2012