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Optimizing product yield using manufacturing defect weights

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5 Author(s)
Bickford, J.P. ; IBM Corp. Syst. & Technol. Group, Essex Junction, VT, USA ; Hibbeler, J.D. ; Mueller, D. ; Peyer, S.
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Yield of 45nm products can be optimized by adjusting how the router is run. While forcing wiring to upper levels adds wire length and increases the number of vias, sensitivity to random defects is reduced. Wire spreading does not improve yield for 45nm products.

Published in:

Advanced Semiconductor Manufacturing Conference (ASMC), 2012 23rd Annual SEMI

Date of Conference:

15-17 May 2012