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Post-bond test techniques for TSVs with crosstalk faults in 3D ICs

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3 Author(s)
Yu-Jen Huang ; Department of Electrical Engineering, National Central University, Jhongli, Taiwan 320 ; Jin-Fu Li ; Che-Wei Chou

Three-dimensional (3D) integration is expected to cope with the difficulties faced by current 2D system-on-chip designs using through silicon via (TSV). However, coupling capacitance exists between two neighboring TSVs such that TSVs are prone to crosstalk faults. In this paper, we propose a builtin self-test (BIST) scheme for the post-bond test of TSVs with crosstalk faults in 3D ICs. A test algorithm for testing crosstalk faults of TSVs is proposed. The proposed BIST scheme has the feature of low area cost. Simulation results show that the area overhead of the BIST circuit implemented with 90nm CMOS technology for a 512×16 TSV array in which each TSV cell size is 15 × 15μm2 is 6.7%.

Published in:

VLSI Design, Automation, and Test (VLSI-DAT), 2012 International Symposium on

Date of Conference:

23-25 April 2012