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Substrate-Integrated Waveguide Vertical Interconnects for 3-D Integrated Circuits

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3 Author(s)
Bassel Youzkatli El Khatib ; Département de Génie Électrique, Poly-Grames Research Center, École Polytechnique de Montréal, Montréal, Canada ; Tarek Djerafi ; Ke Wu

This paper presents and demonstrates a class of 3-D integration platforms of substrate-integrated waveguide (SIW). The proposed right angle E-plane corner based on SIW technology enables the implementation of various 3-D architectures of planar circuits with the printed circuit board and other similar processes. This design scheme brings up attractive advantages in terms of cost, flexibility, and integration. Two circuit prototypes with both 0- and 45° vertical rotated arms are demonstrated. The straight version of the prototypes shows 0.5 dB of insertion loss from 30 to 40 GHz, while the rotated version gives 0.7 dB over the same frequency range. With this H-to-E-plane interconnect, a T-junction is studied and designed. Simulated results show 20-dB return loss over 19.25% of bandwidth. Measured results suggest an excellent performance within the experimental frequency range of 32-37.4 GHz, with 10-dB return loss and less than ±4° phase imbalance. An optimized wideband magic-T structure is demonstrated and fabricated. Both simulated and measured results show a very promising performance with very good isolation and power equality. With two 45° vertical rotated arm bends, two antennas are used to build up a dual polarization system. An isolation of 20 dB is shown over 32-40 GHz and the radiation patterns of the antenna are also given.

Published in:

IEEE Transactions on Components, Packaging and Manufacturing Technology  (Volume:2 ,  Issue: 9 )