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An antenna structure is presented for the front end of the 60Ghz transmitter. The solution takes into account the presence of the silicon chip that comprises the silicon-based transceiver and the interconnections between the transceiver, the antenna and the printed Circuit Board (PCB) for assembling and mounting operations. A 4.7-GHz bandwidth (@VSWR=2) is expected with a maximum gain of 6.7dBi @ 60GHz. This gain value is achieved by efficiently coupling a non resonating structure with a Dielectric Resonator (DR), The integration configuration includes flip-chip and interconnection structures.
Published in:
Antennas and Propagation (EUCAP), 2012 6th European Conference on
Date of Conference: 26-30 March 2012
- Page(s):
- 3260 - 3263
- E-ISBN :
- 978-1-4577-0919-7
- Print ISBN:
- 978-1-4577-0918-0
- INSPEC Accession Number:
- 12772037
- Conference Location :
- Prague
- Digital Object Identifier :
- 10.1109/EuCAP.2012.6206091
- Product Type:
- Conference Publications
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