$\hbox{HfO}_{2}$-Based RRAM Devices With Varying Contact Sizes and Their Electrical Behavior

In this letter, HfO
₂
-based RRAM with varying device sizes is discussed with an analysis of the device-size dependence on reset current (
I
_reset
). Device sizes down to 60 nm were achieved by using different thicknesses of nitride spacer after 200-nm contact hole is formed. Platinum (Pt) bottom electrode and titanium nitride (TiN) top electrode were used with HfO
₂
dielectric as the resistance switching layer. Uniform bipolar switching characteristics with a very low
I
_reset
of about 100 μA are achieved in 60-nm contact size devices. Self-compliance effect is also observed in the scaled devices.