By Topic

Prognostics of thermal fatigue failure of solder joints in avionic equipment

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

2 Author(s)
Johansson, J. ; Saab AB, Sweden ; Leisner, P.

A practical method has been suggested for solder joint thermal fatigue prognostics, which enables real-time fatigue calculations based on uncompressed temperature data embedded in a host system that performs safety-critical operations. The accuracy of the prognosticated remaining useful life depends on the level of details captured in the model, and the level of confidence from validation efforts.

Published in:

Aerospace and Electronic Systems Magazine, IEEE  (Volume:27 ,  Issue: 4 )