Referenced Items are not available for this document.
A recently developed optical-write tool, incorporating a high-output laser with integrated grating light valve (i-GLV), has successfully been used to directly image high-resolution patterns useful for three-dimensional packaging schemes. This technology thus eliminates the need for masks for pattern creation. Automatic correction for any warpage from ultra-thin wafers is performed using a proprietary imaging technology. Different levels of dose intensity can be imaged on the resist in one exposure.
Published in:
Microelectronics and Electron Devices (WMED), 2012 IEEE Workshop on
Date of Conference: 20-20 April 2012
- Page(s):
- 1 - 3
- ISSN :
- 1947-3834
- Print ISBN:
- 978-1-4577-1735-2
- INSPEC Accession Number:
- 12769927
- Conference Location :
- Boise, ID
- Digital Object Identifier :
- 10.1109/WMED.2012.6202615
- Product Type:
- Conference Publications
About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies
A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2013 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.
