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A recently developed optical-write tool, incorporating a high-output laser with integrated grating light valve (i-GLV), has successfully been used to directly image high-resolution patterns useful for three-dimensional packaging schemes. This technology thus eliminates the need for masks for pattern creation. Automatic correction for any warpage from ultra-thin wafers is performed using a proprietary imaging technology. Different levels of dose intensity can be imaged on the resist in one exposure.
Date of Conference: 20-20 April 2012