By Topic

SLIDER: Simulation of Layout-Injected Defects for Electrical Responses

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

2 Author(s)
Wing Chiu Tam ; Dept. of Electr. & Comput. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA ; Blanton, R.D.

Logic-level simulation has been the de facto method for simulating defect/faulty behavior for various testing tasks since it offers a good tradeoff between accuracy and speed. Unfortunately, by abstracting defect behavior to the logic level (i.e., a fault model), it also discards important information that inevitably results in inaccuracies. This paper describes a fast and accurate defect simulation framework called SLIDER (simulation of layout-injected defects for electrical responses). SLIDER uses well-developed mixed-signal simulation technology that is conventionally used for design verification. There are three innovative aspects that distinguish SLIDER from prior work in this area: 1) accuracy resulting from defect injection taking place at the layout level; 2) speedup resulting from careful and automatic partitioning of the circuit into maximal digital and minimal analog domains for mixed-signal simulation; and 3) complete automation that includes defect generation, defect injection, design partitioning, netlist extraction, mixed-signal simulation, and test-data extraction. The virtual failure data created by SLIDER is useful in a variety of settings that include diagnosis resolution improvement, defect localization, fault model evaluation, and evaluation of yield/test learning techniques that are based on failure data analysis.

Published in:

Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on  (Volume:31 ,  Issue: 6 )