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Thermal switch and variable capacitance designed for micro electrostatic converter by using CMOS MEMS process

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4 Author(s)
Jin-Chern Chiou ; Dept. of Electrical Control Engineering, National Chiao Tung University, Hsinchu, Taiwan 300, R.O.C ; Lei-Chun Chou ; You-Liang Lai ; Sheng-Chieh Huang

This paper focuses on implementing a novel thermal switch and variable capacitance design by using commercially available CMOS MEMS process which can approach in a micro electrostatic converter system. In this system, there are two major parts. First is the variable capacitance, and the second is the thermal switch. In the variable capacitance, it implement by UMC 0.18μm one-poly seven-metal (1P7M) CMOS MEMS process. In the post-process, the silicon-oxidation have been released and the gap between two metal layers filled with PDMS (Polydimethylsiloxane). Filling with PDMS is to significantly increase Cmax.

Published in:

Nano/Micro Engineered and Molecular Systems (NEMS), 2012 7th IEEE International Conference on

Date of Conference:

5-8 March 2012