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A low cost, high performance three-dimensional memory module technology

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7 Author(s)
A. Glaser ; Dept. of Electr. & Comput. Eng., North Carolina State Univ., Raleigh, NC, USA ; M. Nakkar ; P. Franzon ; G. Rinne
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We present a new interconnect/chip-attach technology that provides high volumetric efficiency for systems that are not I/O bound, while also providing low weight, good thermal management and low cost. This attach technology, perpendicular chip attach, is well-suited for applications such as memory modules, mixed-signal systems integration, and high-density microelectromechanical systems (MEMS)

Published in:

Memory Technology, Design and Testing, 1997. Proceedings., International Workshop on

Date of Conference:

11-12 Aug 1997