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Nonlinear analyses of semi-embedded through-silicon via (TSV) interposer with stress relief gap under thermal operating and environmental conditions

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3 Author(s)
Lau, J.H. ; Electron. & Optoelectron. Res. Lab., Ind. Technol. Res. Inst. (ITRI), Hsinchu, Taiwan ; Shang-Tsai Wu ; Heng-Chieh Chien

In this study, 3D IC integrations with a semi-embedded TSV interposer with stress relief gap under thermal operating and environmental conditions are investigated. Emphasis is placed on the determination of the TSV interposer warpage and the nonlinear stress and creep strain in the Al/Cu-low-k pads and micro solder joints.

Published in:

Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2012 13th International Conference on

Date of Conference:

16-18 April 2012